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Prof. King-Ning Tu, UCLA

 

Dr. King-Ning Tu    Professor King-Ning Tu
Tel. (310) 206-4838
FAX (310) 206-7353
Email: kntu@ucla.edu

Professor; B.S., National Taiwan University; M.S., Brown University; Ph.D. in Applied Physics, Harvard University(1968); Senior Manager of Materials Science Department at IBM T.J. Watson Research Center; Science Research Council Senior Research Fellow and The Royal Society Guest Research Fellow at Cavendish Laboratory, UK; Fellow of American Physical Society; Fellow of the Metallurgical Society; Overseas Fellow of Churchill College; Application to Practice Award of the Metallurgical Society; Alexander von Humboldt Research Award for senior US scientists; President of the Materials Research Society in 1981.TMS-EMPM Division Distinguished Scientist/Engineer Award, 2006. He is a member of Academia Sinica, ROC.

 

Research Interests

Our research interest is in wafer-based and flux-driven materials science. Modern microelectronic, opto-electronic, bio-sensor, and MEMS devices are built on wafers, involving the growth or removal of mono-layers of atoms from the wafer surface or an inter-phase interface. We deal with open systems, in which the initial wafer surface is constant and the flux can be atoms, molecules, or energy beams.

Our major research areas are (1) Lead (Pb)-free solder metallurgy for electronic and optical packaging technology, (2) Advanced materials reliability problems of microelectronic devices, especially concerning the flip chip technology, and (3) Nanoscale interdiffusion and reactions. In addition, we also conduct exploratory research on (4) Dislocations and grain boundaries in Si, and (5) Kinetic theory of interdiffusion and reactions.

 

Area of Thesis Guidance

Kinetic processes in thin films, metal-silicon interfaces, electromigration, Pb-free interconnects.

 

Recent Publications

Papers

  1. J. O. Suh, K. N. Tu, G. V. Lutsenko and A. M. Gusak, "Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper," Acta Mat., 56, 1075-1083 (2008).
  2. Yung-Chen Lin, Kuo-Chang Lu, Wen-Wei Wu, Jingwei Bai, Lih J. Chen, K. N. Tu, and Yu Huang, "Single crystalline PtSi nanowires, PtSi/Si/PtSi nanowire heterostructures, and nanodevices," Nano Letters 8, 913-918 (2008).
  3. Yuhaun Xu, Shengquen Ou, K. N. Tu, Kejun Zeng, and Rajiv Dunne, "Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester", J. Mater. Res., 23, 1482-1487 (2008).
  4. Dong-Hua Wang, Di Xu, Qing Wang, Ya-Juan Hao, Guo-Qiang Jin, Xiang-Yun Guo, and K. N. Tu, "Periodically twinned SiC nanowires", Nanotechnology, 19, 215602 (2008).
  5. Michael Tong, David Sturgess, K. N. Tu, and Jenn-Ming Yang, ¡°Solder joints fabricated by explosively reacting nanolayers,¡± Appl. Phys. Lett. 92, 144101 (2008).
  6. Zhenghao Gan, A. M. Gusak, W. Shao, Zhong Chen, S. G. Mhaisalkar, T. Zaporozhets, and K. N. Tu, "Analytical modeling of reservoir effect on electomigration in Cu interconnects," J. Mater. Res., 22, 152-156 (2007).
  7. Luhua Xu, Pradeep Dixit, Jianmin Miao, John H. L. Pang, Xi Zhang, and K. N. Tu, "Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins," Appl. Phys. Lett., 90, 033111 (2007).
  8. Chengkun Xu, Xi Zhang, K. N. Tu, and Y. H. Xie, "Nickel displacement deposition of porous silicon with ultrahigh aspect ratio," J. of Electrochemical Society, 154(3), D170-D174 (2007).
  9. K. N. Tu, Chin Chen, and Albert T. Wu, "Stress analysis of spontaneous Sn whisker growth," J. Mater. Sci: Mater. Electron., 18, 269-281 (2007).
  10. W. Shao, S. G. Mhaisalkar, T. Sritharan, A. V. Vairagar, H. J. Engelmann, O. Aubel, E. Zschech, A. M. Gusak, and K. N. Tu, "Direct evidence of Cu/cap/liner edge being the dominant electromigration path in dual damascene Cu interconnects," Appl. Phys. Lett., 90, 052106 (2007).
  11. Xi Zhang, Zhong Chen, and K. N. Tu, "Immersion nickel deposition on blank silicon in aqueous solution containing ammonium fluoride", Thin Solid Films, 515, 4696-4701 (2007).
  12. Jae-Woong Nah, Kai Chen, K. N. Tu, Bor-Rung Su, and Chih Chen, "Mechanism of electromigration-induced failure in flip chip solder joints with a 10 micron thick Cu under-bump-metallization", J. Mater. Res., 22, 763-769 (2007).
  13. Chengkun Xu, Mingheng Li, Xi Zhang, K. N. Tu, and Y. H. Xie, "Theoretical studies of displacement deposition of Ni into porous Si with ultrahigh aspect ratio", Electrochimica Acta, 52, 3901-3909 (2007).
  14. J. W. Jang, J. K. Lin, D. R. Frear, T. Y. Lee, and K. N. Tu, "Ripening-assisted void formation in the matrix of Pb-free solder joints during solid-state aging," J. Mater. Res., 22, 826-830 (2007).
  15. Fan-Yi Ouyang, K. N. Tu, Chin-Li Kao, and Yi-Shao Lai, "Effect of electromigration in the anode Al interconnect on melting of flip chip solder joints," Appl. Phys. Lett., 90, 211914 (2007).
  16. Kuo-Chang Lu, K. N. Tu, W. W. Wu, L. J. Chen, Bong-Young Yoo, and Nosang V. Myung, "Point contact reactions between Ni and Si nanowires and reactive epitaxial growth of axial nano-NiSi/Si," Appl. Phys. Lett., 90 253111 (2007).
  17. Kuo-Chang Lu, Wen-Wei Wu, Han-Wei Wu, Carey M. Tanner, Jane P. Chang, Lih J. Chen, and K. N. Tu, "In-situ control of atomic-scale Si layer with huge strain in the nano-heterostructure NiSi/Si/NiSi through point contact reaction," Nano Letters, Vol. 7, No. 8, p. 2389-2394, (2007).
  18. Jong-ook Suh, K. N. Tu, and N. Tamura, "Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu," Appl. Phys. Lett., 91, 051907 (2007).
  19. K. N. Tu, "Solder Joint Technology: Materials, properties, and reliability", 368 pages, Springer, 2007. ISBN - 13: 978-0-387-38890-8
  20. Dan Yang, B. Y. Wu, Y. C. Chan and K. N. Tu, "Microstructural evolution and atomic transport by thermomigration in eutectic SnPb flip chip solder joints," J. Appl. Phys. 102, 043502 (2007).
  21. J. O. Suh, K. N. Tu, and N. Tamura, "Preferred orientation relationship between Cu6Sn5 scallops-type grains and Cu substrate in reactions between molten Sn-based solders and Cu," J. Appl. Phys., 102, 063511 (2007).
  22. Xi Zhang, K. N. Tu, Zhong Chen, Y. K. Tan, C. C. Wong, S. G. Mhaisalkar, X. M. Li, C. H. Tung, and C. K. Cheng, "Pulse Electroplating of Copper Film: A Study of Process and Microstructure, "Journal of Nanoscience and Nanotechnology, Vol.8, No.3,1-7 (2007).
  23. Fan-Yi Ouyang, Kai Chen, K. N. Tu, and Yi-Shao Lai, "Effect of current crowding on whisker growth at the anode in flip chip solder joints,"Appl. Phys. Lett., 91, 231919 (2007).
  24. Di Xu, Wei Lek Kwan, Kai Chen, Xi Zhang, Vidvuds Ozolins, and K. N. Tu, "Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition," Appl. Phys. Lett., 91, 254105 (2007).
  25. L. L. Zhao, N. Li, A. Langner, M. Steinhart, T. Y. Tan, E. Pippel, H. Hofmeister, K. N. Tu, and U. Goesele, "Crystallization of amorphous SiO2 microtubes catalyzed by lithium,"Advanced Functional Materials, 17, 1952-1957 (2007).

Books

 

Awards

  • American Physical Society - Fellow, 1981
  • The Metallurgical Society - Fellow, 1988
  • Churchill College - Overseas Fellow, 1990
  • Materials Research Society - President, 1981
  • The Metallurgical Society - Application to Practice Award, 1988
  • Alpha Sigma Mu Lecturer of American Society for Metals, 1986
  • Acta/Scripta Metallurgica Lecturer, 1990 - 1992
  • Humboldt Research Award for Senior US scientists, 1996
  • Honorary Member of The Korean Institute of Metals and Materials, 1996
  • Certificate of Appreciation from SEMATECH for flip chip study, 1998
  • Member of Academia Sinica, ROC, 2002
  • Founder's Award - Ions at Caltech: 1967-1976, 2003

 

Professional Activities

 

Organizer and Co-Chairman, TMS-ASM Symposia

10/72

  

Advance in Amorphous-to-Crystalline Phase Transformations, Cleveland

11/75

  

Interfacial Reactions in Solids, Cincinnati

10/77

  

Diffusion Studies in thin Films, Chicago

10/78

  

Diffusion, Phase Transformations and Deformation in Low-Melting Point Metals, St. Louis

09/79

  

Thin-film Microstructure and Properties, Milwaukee

02/96

  

Materials and Technologies for Microelectronics, Anaheim

02/97

  

Electrically Conductive Materials, Orlando

 

Organizer and Co-Chairman, MRS Symposia

11/79

  

Semiconductor Interfaces, Cambridge

11/81

  

Thin Films and Interfaces, Boston

11/84

  

Electronic Packaging Materials Science, Boston

11/85

  

Phase Transformations in Condensed Systems - Experiments and Theory, Boston

11/87

  

Poly-Si Films and Interfaces, Boston

11/93

  

Silicide, Germanide and their Interfaces, Boston

04/94

  

Advanced Metallization for VLSI, San Francisco

04/95

  

Electronic Packaging Materials Science VIII, San Francisco

04/96

  

Advanced Metallization for future ULSI, San Francisco

04/98

Advanced Interconnects and Contacts, San Francisco

 

Other Activities

Society Committee Membership

1989-1992

  

Member, External Advisory Board, Center for Joining of Materials, Carnegie-Mellon University

1989-1992

  

IBM Ph.D. recruiter at Department of Metallurgy and Materials Science, Carnegie-Mellon University

1989-1993

  

IBM Ph.D. recruiter at department of Materials Science, Cornell University

1989-1994

  

Member, NSF on-site Review committee, Materials Research Laboratory, NSF Panel Review of Materials Research Group, Science and Technology Center, and Engineering Research Center

08/74

  

Member, Organizing Committee, International Conference on Low-Temperature Diffusion and Applications to Thin Films, Yorktown Heights, New York

11/80          

  

Program Co-Chairman, Annual Meeting of MRS, Boston

10/89

  

Program co-chairman, the 2nd International Conference on Solid State and Integrated Circuit Technology, Beijing, China (did not attend the Conference)

1989-1995

  

Member, Technical Advisory Committee to Materials Research Laboratory in Industrial Technology Research Institute, Hsinchu, Taiwan, ROC (organized by the late Dr. Wen Y. Pan)

10/92

  

Member, International Advisory Committee, the 3rd International Conference on Solid State and Integrated Circuit Technology, Beijing, China

08/93

  

Member of Review of Division of Materials Research, NSF

12/94

  

Member, Program Committee, International Conference on Electronic Materials, Hsinchu, Taiwan, ROC

12/94

  

Member, Program Committee, 7th International Conference on Solid Films and Surface, Hsinchu, Taiwan, ROC

12/95

  

Co-Organizer on Symp. on film Preparation and Characterization at the Joint Meeting between Japan Institute of Metals and TMS of U.S., Hawaii

12/96

  

Program Co-Chairman, International Electron Devices and Materials Symposia, Hsinchu, Taiwan, ROC

10/98

Program co-Chairman, the 5th International Conference on Solid State and Integrated Circuit Technology, Beijing, China

2000

External Examiner, Dept. of Materials Science & Engineering, National Tsinghua University, Hsinchu, ROC.

2001-2004

External Examiner, Dept. of Physics and Materials Science, City University of Hong Kong, Hong Kong.

2002-2004

  

External Examiner, Dept. of Physics, National Institute of Education, Nanyang Technology University, Singapore

Dec. 2002

  

The Royal Society/Kan Tong Po visiting professorship to Dept. of Electric Engineering, City University of Hong Kong, Hong Kong

Sept. 2002

  

Tan Kah Kee visiting professorship in School of Materials Engineering, Nanyang Technology University, Singapore

1982-1983

  

Chair, Long-Range Planning Committee, MRS

1989-1992

  

Member, Electronic Materials Committee, TMS

1985-1988

  

Member, Award Committee on Institute of Metals Lecture and Robert F. Mehl Award of AIME

1986-1987

  

Member, Committee on Materials with submicron-sized Microstructure, National Materials Advisory Board, NRC

1989-1992

  

Member, Joint ASM/TMS Committee on Distinguished Lectureship in Materials and Society

1989-1993

  

Member, TMS Fellow Award Committee

1989-1994

  

Member, Award Committee on Institute of Metals Lecture and Robert F. Mehl Award of AIME

1996-1999

  

Member, TMS Fellow Award Committee

1999-2000

  

Chair, TMS Fellow Award Committee

2000-2004

  

Member, Advisory Board of Dept. of Chemical and Environmental Engineering, UC Riverside

2002-2004

  

Chair, Executive Committee of UC-SMART Program

2002-2007

  

Member, International Advisory Committee, Shangyang National Laboratory for Materials Science, Shangyang, China.

 

Editorial Boards of Scientific Journals

1984-1992

  

Materials Letters, Associate Editor

1986-1992

  

Materials Science Reports, Member of Editorial Board

1989-1992

  

Journal of Materials Research, Principal Editor

1992-Now

  

Materials Chemistry and Physics

 

Courses Taught

MSE 130  Phase Relations in Solids
MSE 131  Diffusion and Diffusion-Controlled Reactions
MSE 131L  Diffusion and Diffusion-Controlled Reactions Laboratory
MSE 201  Principle of Materials Science (Solid State phase changes)
MSE 223  Thin Film Materials Science

 

Course Descriptions

Links

Personal Homepage: www.seas.ucla.edu/eThinFilm/professor.html

Research Group/Lab: Electronic Thin Film Lab

 

Office Location

  • 3121-D Engineering V

 

Mailing Address

  • UCLA, HSSEAS School of Engineering & Applied Sciences
    Department of Materials Science and Engineering
    410 Westwood Plaza
    3111 Engineering V
    Los Angeles, CA 90095-1595
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